发明名称 |
No-flow underfill encapsulant |
摘要 |
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
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申请公布号 |
US6624216(B2) |
申请公布日期 |
2003.09.23 |
申请号 |
US20020062906 |
申请日期 |
2002.01.31 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
MORGANELLI PAUL;DEBARROS ANTHONY;WHEELOCK BRIAN;SHAH JAYESH |
分类号 |
C08G59/42;C08G59/68;C08L63/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):C08K5/541;C08L63/02 |
主分类号 |
C08G59/42 |
代理机构 |
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