发明名称 System configured for applying a modifying agent to a non-equidimensional substrate
摘要 The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
申请公布号 US6623686(B1) 申请公布日期 2003.09.23
申请号 US20000677336 申请日期 2000.09.28
申请人 BECHTEL BWXT IDAHO, LLC 发明人 JANIKOWSKI STUART K.;TOTH WILLIAM J.;GINOSAR DANIEL M.;ALLEN CHARLES A.;ARGYLE MARK D.;FOX ROBERT V.;PROPP W. ALAN;MILLER DAVID L.
分类号 B05D1/18;B05D7/20;C03C25/12;C03C25/22;D06M23/10;(IPC1-7):B05D5/00;B05D3/04;B08B1/02 主分类号 B05D1/18
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