发明名称 |
Production of a tailless ball bump |
摘要 |
A method of producing a ball bump on a workpiece employs a capillary having a passageway therethrough. A wire extends through the passageway and has a ball formed on its end below the capillary. The capillary is positioned above a bond site and is lowered until the ball contacts the bond site. The capillary simultaneously applies ultrasonic energy and a downward force against the ball to deform the ball to a ball bump and bond it to the bond site. The capillary is thereafter displaced in a first direction to break the wire away from the ball bump. The capillary is then displaced in a second direction across the ball bump to engage any residual wire protruding from the ball bump surface and substantially smooth the residual wire against the ball bump surface.
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申请公布号 |
US6622903(B1) |
申请公布日期 |
2003.09.23 |
申请号 |
US20020108038 |
申请日期 |
2002.03.27 |
申请人 |
PALOMAR TECHNOLOGIES, INC. |
发明人 |
GREENWELL MARK S. |
分类号 |
B23K20/00;(IPC1-7):B23K1/06;B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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