| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve the simplification of a test process and the reduction of testing cost. SOLUTION: The burn-in test of a semiconductor element is performed in such a state that the projected electrodes 12 of the test substrate 10 and the electrical connection electrode 3a of a semiconductor element 3 are bonded under heating and pressure and, when the semiconductor element 3 is peeled from the test substrate 10 after the test of the semiconductor element 3 is completed, the projected electrodes 12 are peeled from the test substrate 10 along with the semiconductor element 3 and the projected electrodes 12 are formed on the semiconductor element 3 to simultaneously perform the test of the semiconductor element 3 and the formation of the projected electrodes 12 to the semiconductor element 3.</p> |
