ATTACHMENT OF SURFACE MOUNT DEVICES TO PRINTED CIRCUIT BOARDS USING A THERMOPLASTIC ADHESIVE

摘要

A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device, and heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board. There is also provided an assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board. There is further provided a thermoplastic adhesive composition having at least (A) from 5 % to 98 % by weight of a functionalized polyolefin, and (B) from 2 % to 95 % by weight of a polyamide compound.