发明名称
摘要 PROBLEM TO BE SOLVED: To provide a molding device equipped with a marking mechanism capable of corresponding with even a thin type of a molded product by controlling dispersion in dimensional precision of a mark part and its manufacturing cost by a method wherein the mark part is formed by laser beam machining on a mark surface of a marking mechanism. SOLUTION: In a molding device equipped with a first ejector pin jointly used for a marking mechanism forming a mark on a resin-sealed molded product, a mark surface 20 abutting against sealed resin of the molded product of the first ejector pin is formed so that a satin-like mark part 20a formed by laser beam machining is a surface different in contrast from a specular part 20b around that.
申请公布号 JP3448401(B2) 申请公布日期 2003.09.22
申请号 JP19950191831 申请日期 1995.07.27
申请人 发明人
分类号 B29C33/38;B29C45/26;B29C45/37;B29C45/40;B29L31/34;(IPC1-7):B29C45/40 主分类号 B29C33/38
代理机构 代理人
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