TECHNIQUE FOR REDUCING THE NUMBER OF LAYERS IN A MULTILAYER CIRCUIT BOARD

摘要

A technique for reducing the number of layers in a multilayer circuit, board is disclosed. The multilayer circuit board has a plurality of electrically conductive signal layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board. In one embodiment, the technique is realized by a method for reducing the number of layers in a multilayer circuit board, the multilayer circuit board having a plurality of electrically conductive signal layers for routing electrical signals, to and from at least one electronic component mounted on a surface of the multilayer circuit board. The method comprises the steps of: forming a plurality of electrically conductive vial in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers; arranging the surface such than a first set of two power/ground pins corresponds to first via and a second set of two power/ground pins corresponds to a second via positioned adjacent the first via, thereby creating a channel; and routing a first plurality of electrical signals through the channel on the first of the plurality of electrically conductive signal layers.