| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for decreasing a chip size of the semiconductor device enabling package processing with a thin thickness and surface mounting. <P>SOLUTION: The semiconductor device has a structure with recessed electrode parts 2 of a semiconductor substrate 3 from the surface of the semiconductor substrate 3, and the electrode parts 2 are recessed from two circumferential sides. <P>COPYRIGHT: (C)2003,JPO |
