| 摘要 |
PROBLEM TO BE SOLVED: To provide a camera module mechanically and environmentally strong against the outside. SOLUTION: A structure in which an IC such as the IC for control and components such as a resistor and a capacitor are covered with a case is attained. An image sensor is mounted on a board and the image sensor is covered with a camera holder with a lens. Then, the IC such as the IC for the control and the components such as the resistor and the capacitor are mounted on the opposite side of the substrate and the camera module having the structure covered with the case is attained. COPYRIGHT: (C)2003,JPO
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