SEMICONDUCTOR PACKAGE HAVING ANTI-OXIDATION COPPER WIRE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package having an anti-oxidation copper wire and a method for manufacturing the same are provided to be capable of improving the reliability of the semiconductor package and preventing the deterioration of electric characteristics. CONSTITUTION: A semiconductor package is provided with a lead frame pad(110), a semiconductor chip(120) attached to the lead frame pad through an epoxy resin part(130), an aluminum electrode pad(122) formed at the upper predetermined portion of the semiconductor chip, a protecting layer(124) formed on the upper surface of the semiconductor chip except the aluminum electrode pad region, an inner lead(140) of the lead frame, and an anti-oxidation copper wire(150) electrically connecting the aluminum electrode pad with the inner lead. Preferably, the anti-oxidation copper wire is made of a copper wire and an anti-oxidation layer formed on the outer surface of the copper wire for enclosing the copper wire.