| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device in which a conductive paste allows high adhesion when a semiconductor chip is mounted on a lead frame, etc., with less degradation in adhesion after hygroscopic process, and improves cracking-resistance at hygroscopic reflow with the semiconductor device. SOLUTION: The conductive paste comprises, as essential ingredient, (A) epoxy resin, (B) compound containing 5 membered-ring dithiocarbonate radical such as 5-(methacryloyloxy)methyl-1,3-oxathiolane-2-thion, (C) amine compound such as 4,4'-diaminodiphenylmethane, and (D) conductive powder. COPYRIGHT: (C)2003,JPO
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