| 摘要 |
PURPOSE: A reverse fountain type plating apparatus is provided in which precision plating is enabled even at a bumper higher than a flat plate or wafer having narrow and deep trench, and manual operation is not necessary so that defects due to dust adhered to workpiece is fundamentally prevented. CONSTITUTION: In a plating apparatus comprising a plating pot(1) in which plating solution is contained, a pump(6) for supplying plating solution filtered by filter(7) into the plating pot(1) through pipe(8) in a certain pressure, and a power supply(5) for supplying direct current power to the plating solution and object to be plated(4), the reverse fountain type plating apparatus is characterized in that the plating pot(1) is sealed by chamber(2), a jig(3) for setting the object to be plated(4) is installed with being spaced apart in a certain distance from the lower part of the plating pot(1) on which discharge holes(12) are formed, and the plating solution is sprayed onto the upper part of the plating pot(1) through sparger(21) installed at an end of the pipe(8), wherein a vertically movable cylinder is mounted on the lower part of the jig(3), wherein a rotational motor is mounted on the lower part of the jig(3), and wherein a vibrator is mounted on the lower part of the jig(3).
|
