| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which a Manhattan phenomenon of a ceramic element assembly in a soldering process can be evaded. <P>SOLUTION: The ceramic element assembly is almost in a rectangular parallelopiped shape. Terminal electrodes 31, 32 are disposed on both end sides in the length direction L of the element assembly 1. The terminal electrode 31 is disposed covering one surface 11 in the length direction L, a part of both surfaces 13, 14 in the width direction W and a part of both surfaces 15, 16 in the thickness direction T. The terminal electrode 32 is disposed covering a part of the other surface 12 in the length direction L, a part of both the surfaces 13, 14 in the width direction W and a part of both the surfaces 15, 16 in the thickness direction T. When the length of the ceramic element assembly is L1, lengths of the terminal electrodes 31, 32 on one surface 13 in the width direction W are L3, and the lengths of the terminal electrodes 31, 32 on the other surface 14 in the width direction W are L4, a relation of 0≤|L4-L3|/L1≤1/44 is satisfied. <P>COPYRIGHT: (C)2003,JPO</p> |
