| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which a fine pattern can be formed, the adhesion strength of a wiring layer is large, and connection is excellent. SOLUTION: A through-hole 102 is formed in an insulation base component 101, a conductive material 104 is filled into the through-hole 102, and a metal wiring layer 108, which is connected to metal particles 106 or the set of the metal particles that has a desired shape and is buried near a surface including at least one of the surfaces of the insulation base component 101, is formed. COPYRIGHT: (C)2003,JPO |
