| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which is superior in conductive reliability between conductive layers, and enable high-density surface and interior mounting. SOLUTION: The printed wiring board comprises a core substrate 7; coating layers 61, 62 coating the surface; an upper conductive layer 51 and a lower conductive layer 52 provided at the upside and downside of the core substrate and coating layer via them; and an interlayer conductive part 2 for energizing the upper conductive layer and the lower conductive layer. The interlayer conductive part comprises a core hole 1 formed in the coating layer; surface layer holes 21, 22 formed in an offset position with respect to the core hole in the core substrate; and connection patterns 31, 32 for electrically connecting the core hole and the surface layer hole. Both the core hole and the surface layer hole are opened by the irradiation of a laser, and conductivity is imparted thereto by a metal plating film coating the inner wall or a conductive material filled therein. Both one opening of the core hole and one opening of the surface layer hole are coated with coating pads. COPYRIGHT: (C)2003,JPO |
