| 摘要 |
PROBLEM TO BE SOLVED: To industrially provide a circuit board material of plating type wherein an initial adhesive force to plated copper formed on a heat-resistant film is high and the deterioration of adhesive force is extremely small after a high temperature thermal load is applied and after tin plating is performed. SOLUTION: In this board for a printed circuit, a heat-resistant resin layer and a conductive metal layer are laminated in order at least on the single side of a heat-resistant insulating film. The heat-resistant resin layer is composed of resin having at least one among a sulfone base, sulfoxide base and sulfide base, and the conductive metal layer is a plated layer. COPYRIGHT: (C)2003,JPO
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