| 摘要 |
PROBLEM TO BE SOLVED: To prevent the misconception and non-diocriminability of alignment marks. SOLUTION: The alignment marks 11a, 11b are formed on first outer layer copper foil 2 arranged on a PCB board 1 formed of a multilayer structure. In the vicinity of a part immediately below the alignment marks 11a, 11b, a solid pattern region 13 is formed on second inner layer copper foil 5. A blank region 12 in which a conductor wiring pattern does not exist is formed in the vicinity of a part immediately below the alignment marks 11a, 11b of first inner layer copper foil 4 which is positioned between the first outer layer copper foil 2 on which the alignment marks 11a, 11b are formed and the second inner layer copper foil 5 on which the solid pattern region part 13 is formed. When the PCB board 1 is aligned with the other member by using an automatic machine, the alignment marks 11a, 11b are not overlapped with the conductor wiring pattern of the first inner layer copper foil 4, and the contrast of the marks is enhanced, so that the misconception by the automatic machine can be prevented. COPYRIGHT: (C)2003,JPO
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