| 摘要 |
PURPOSE: A cylindrical semiconductor package and a cable type package module using the same are provided to be capable of improving the degree of integration and increasing memory capacity. CONSTITUTION: A cylindrical semiconductor package is provided with a package board, an IC(Integrated Circuit) chip(20) attached on the package substrate, a metal wire(30) for electrically connecting the package board to the IC chip, and a resin encapsulating part(40). The package board includes a chip attaching region(11), an inner connection region, and a cylindrical outer connection region(13). At this time, an inner connection terminal(14) is formed at the upper and lower surface of the inner connection region and an outer connection terminal(15) is formed at the lateral surface of the outer connection region. An inner connection pattern(16) is formed between the inner and outer connection region.
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