| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing the exposure of a metal fine wire and thinning an entire thickness while sufficiently securing the thickness of a sealing body. <P>SOLUTION: A semiconductor chip 4 mounted on a substrate 2 having an electrode 6 is fixed with an adhesive 1, and the electrode 6 and an electrode 5 on the semiconductor chip 4 are electrically connected with a conductor 7. Furthermore, a frame 9 of a sealing body outflow prevention means having a side facing the side of the semiconductor chip 4 is provided on the circumference of the semiconductor chip 4 and the conductor 7. Thereafter, an auxiliary material 101 is installed on the semiconductor chip 4, and the semiconductor chip 4 and the conductor 7 are sealed by injecting a sealing body 8 between the auxiliary material 101 and the frame 9. Thus, the thin semiconductor device is obtained. <P>COPYRIGHT: (C)2003,JPO |
