| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame commonly usable to semiconductor chips of different chip sizes. <P>SOLUTION: This lead frame for semiconductor chips comprises outer leads 113 composed of a plurality of conductors mutually arranged almost parallel, inner leads 112 which are connected to the outer leads 113, and the top edges of which are extended to prescribed positions of the lower face of the semiconductor chip while spaces at the top edges are narrower than those of the outer leads 113, and plated layers 119 formed on the inner leads 112 along almost the total length thereof. <P>COPYRIGHT: (C)2003,JPO |
