发明名称 DEVICE AND METHOD FOR POLISHING, AND DETECTING METHOD FOR REST OF POLISHING
摘要 <P>PROBLEM TO BE SOLVED: To easily perform additional polishing by performing additional polishing with high accuracy based on the measured amount of the rest of polishing and preventing the rest of polishing from oxidizing. <P>SOLUTION: This is a method for detecting the rest of polishing left when a metal film formed over lower layer metal wiring with an insulation film between is polished. The insulation film is irradiated with multi-wavelength, and the wavelength dependency of reflection coefficient of reflected light having a wavelength proximate to the thickness of the insulation film is measured, to measure the amount of the rest of polishing of the metal film. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003264163(A) 申请公布日期 2003.09.19
申请号 JP20020064799 申请日期 2002.03.11
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC 发明人 SEKIGUCHI MITSURU
分类号 G01B11/06;B24B37/07;H01L21/304;H01L21/3205;H01L21/321;H01L21/768 主分类号 G01B11/06
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