发明名称 |
DEVICE AND METHOD FOR POLISHING, AND DETECTING METHOD FOR REST OF POLISHING |
摘要 |
<P>PROBLEM TO BE SOLVED: To easily perform additional polishing by performing additional polishing with high accuracy based on the measured amount of the rest of polishing and preventing the rest of polishing from oxidizing. <P>SOLUTION: This is a method for detecting the rest of polishing left when a metal film formed over lower layer metal wiring with an insulation film between is polished. The insulation film is irradiated with multi-wavelength, and the wavelength dependency of reflection coefficient of reflected light having a wavelength proximate to the thickness of the insulation film is measured, to measure the amount of the rest of polishing of the metal film. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003264163(A) |
申请公布日期 |
2003.09.19 |
申请号 |
JP20020064799 |
申请日期 |
2002.03.11 |
申请人 |
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC |
发明人 |
SEKIGUCHI MITSURU |
分类号 |
G01B11/06;B24B37/07;H01L21/304;H01L21/3205;H01L21/321;H01L21/768 |
主分类号 |
G01B11/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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