发明名称 SEMI-CONDUCTIVE RESIN MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semi-conductive resin molded article having a uniform resistance value in the semi-conductive region. <P>SOLUTION: The semi-conductive molded article is comprised by molding a conductive thermal plastic resin composition composed by mixing (C) the thermal plastic resin and/or a thermal plastic elastomer of 0.1-80 pts.wt. except the component (C) to a conductive resin component comprising (A) a matrix thermal plastic resin and (B) a fine carbon fiber having an average fiber diameter of 200 nm or less of 0.1-20 wt.%. The component 3 (C) is not completely dissolved with the component 1 (A) and is dispersed in a sea-island form, the component 3 (C) forms a dispersion phase in an island form and an average value of the short diameter Rmin of the dispersion phase of the component 3 (C) is 10 &mu;m or less. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003261688(A) 申请公布日期 2003.09.19
申请号 JP20020060632 申请日期 2002.03.06
申请人 YUKA DENSHI CO LTD 发明人 SAGISAKA KOICHI
分类号 C08J5/04;C08K7/06;C08L101/00;H01B1/24 主分类号 C08J5/04
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