发明名称 |
DEVICE AND METHOD FOR HANDLING WAFER |
摘要 |
PROBLEM TO BE SOLVED: To regulate a drawing position by surely drawing a wafer. SOLUTION: A wafer handling means 6 which handles the wafer 2 carried on a carrier 1 at one place of a periphery of the carrier 1, and draws out the wafer 2 to a regulating position from a storing position of at least a magazine 3 by straight advance, is provided with a handler 7 performing handling at an front edge part directed to the side of the magazine 3. The handler 7 has a support part 17 for moving with an orthogonal direction component to the straight advance direction, and the purpose is attained by exerting a energizing means 18 restoring to an original position. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003264212(A) |
申请公布日期 |
2003.09.19 |
申请号 |
JP20020065635 |
申请日期 |
2002.03.11 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
UENO YASUHARU;SHIDA SATOSHI;MINAMITANI SHOZO;ONOBORI SHUNJI;MAE TAKAHARU |
分类号 |
H01L21/677;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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