发明名称 DEVICE AND METHOD FOR HANDLING WAFER
摘要 PROBLEM TO BE SOLVED: To regulate a drawing position by surely drawing a wafer. SOLUTION: A wafer handling means 6 which handles the wafer 2 carried on a carrier 1 at one place of a periphery of the carrier 1, and draws out the wafer 2 to a regulating position from a storing position of at least a magazine 3 by straight advance, is provided with a handler 7 performing handling at an front edge part directed to the side of the magazine 3. The handler 7 has a support part 17 for moving with an orthogonal direction component to the straight advance direction, and the purpose is attained by exerting a energizing means 18 restoring to an original position. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003264212(A) 申请公布日期 2003.09.19
申请号 JP20020065635 申请日期 2002.03.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UENO YASUHARU;SHIDA SATOSHI;MINAMITANI SHOZO;ONOBORI SHUNJI;MAE TAKAHARU
分类号 H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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