| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate carrier 3 which can support a substrate W without bending the substrate largely even in the case of a large and thin substrate W. SOLUTION: The hand mechanism 40 of the substrate carrier 3 is provided with first to third arm mechanisms 50X1, 50X2, and 50X3. The first to third arm mechanisms 50X1, 50X2, and 50X3 are provided with pins P1a to P3b for supporting the undersurface of the substrate W. The pins P1a to P3b shift in an x-y direction by the drive of motors MX1, MX2, and MX3 and motors My1a and My1b so as to support the undersurface of a section with no pattern on the substrate W. COPYRIGHT: (C)2003,JPO |
