| 摘要 |
PROBLEM TO BE SOLVED: To suck, move and mount a thin semiconductor chip 20 by using a suction collet 10. SOLUTION: The vacuum collet 10 has a ventilation hole 11 inside, and a flat face 12 is provided on the leading edge part. In addition, a stopper 15 extending downward further from the flat face 12 is provided on the vacuum collet 10. The flat face 12 is contacted on the surface of the semiconductor chip 20, which is sucked by being sucked from the ventilation hole 11. In a process for mounting the semiconductor chip 20 on a mounting face, damage to the semiconductor chip 20 can be prevented by contacting the stopper 15 to the mounting face. Furthermore, the thickness of a solder material 40 can be kept constant. COPYRIGHT: (C)2003,JPO |
