发明名称 |
MICROWAVE MULTI-CHIP MODULE STRUCTURE AND METHOD FOR PRODUCING THE SAME |
摘要 |
PURPOSE: A microwave multi-chip module structure and a method for manufacturing the same are provided to remove a parallel plate leakage regardless of the operating signal wavelength. CONSTITUTION: A microwave multi-chip module structure comprises a first layer green sheet(111) having a bottom surface on which a lower grounding conductor(102) is printed, and an interior where air cavities(108) are formed at a constant interval; a second layer green sheet(112) deposited on the first layer green sheet; and a third layer green sheet(113) deposited on the second layer green sheet, and which has a top surface on which an upper grounding conductor(100) and a signal line conductor(104) are printed. |
申请公布号 |
KR20030074582(A) |
申请公布日期 |
2003.09.19 |
申请号 |
KR20030061414 |
申请日期 |
2003.09.03 |
申请人 |
INFORMATION AND COMMUNICATIONS UNIVERSITY EDUCATIONAL FOUNDATION |
发明人 |
CHO, YUN HUI;LEE, YEONG CHEOL;PARK, CHEOL SUN |
分类号 |
H05K3/46;H01L23/12;H01P3/00;H01P3/02;H01P3/08;H01P11/00;H05K1/02;H05K1/03;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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