METHOD AND APPARATUS FOR MANUFACTURING STACKED SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A method and apparatus for manufacturing a stacked semiconductor chip package are provided to be capable of preventing the semiconductor chip package attached on a lead frame from being damaged by stacking a unit semiconductor chip package on the lead frame after previously forming the lead frame. CONSTITUTION: After capsizing the first lead frame(30) for facing the first portion of a land(20) upward, the first mask(31) is located on the first portion of the land. After carrying out the first solder printing process, the mask is removed. Then, the first unit semiconductor chip(34) is reversely mounted on the resultant structure. At this time, the first lead(35) of the first unit semiconductor chip is connected to the first portion of the land by carrying out the first heat treatment in an oven. Then, an air cooling process is carried out at the resultant structure. After locating the second mask on the second portion of the land, the second solder printing process is carried out. Then, the second unit semiconductor chip(36) is forwardly mounted on the resultant structure. At this time, the second lead(37) of the second unit semiconductor chip is connected to the second portion of the land by carrying out the second heat treatment.