| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, the method excellent in sensitivity, resolution, adhesiveness, developing property, contaminating property of a plating bath, productivity and workability and effective for increasing the density of printed wiring. <P>SOLUTION: The photosensitive composition comprises (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated group in the molecule and (C) a photopolymerization initiator. The component (C) essentially comprises at least one kind selected a group of compounds expressed by general formula (1), general formula (2), general formula (3) or general formula (4). <P>COPYRIGHT: (C)2003,JPO |
