| 发明名称 |
METHOD OF MANUFACTURING CIRCUIT SUBSTRATE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve quality and productivity by improving manufacturing yield. <P>SOLUTION: In a method of manufacturing a circuit substrate in which holes are formed in a substrate material using laser, the hole is formed by laser for the substrate material which has been irradiated with an ultraviolet ray or exposed to an ozone atmosphere in regard to an organic substance which is inferior in machinability other than a main material constituting the substrate material. <P>COPYRIGHT: (C)2003,JPO</p> |
| 申请公布号 |
JP2003264357(A) |
申请公布日期 |
2003.09.19 |
| 申请号 |
JP20030017104 |
申请日期 |
2003.01.27 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HIGASHIDA TAKAAKI;OTANI HIROYUKI;IWAKI TAKAHIKO |
| 分类号 |
B23K26/00;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/00 |
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