<p>Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215 DEG C.</p>
申请公布号
SG98429(A1)
申请公布日期
2003.09.19
申请号
SG20000005828
申请日期
2000.10.11
申请人
SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTD
