Noiseless modular housing system for e.g. computer has multi-layer cooling system with metal base plate having higher coefficient of thermal conduction than aluminum and on one side layer of aluminum with or without cooling fins

摘要

The housing system (1) includes heat conducting pipes (18) with adaptor system and isolated multi-layer cooling systems (4) or heat sinks, which conduct heat generated by electric components integrated into the housing system, and a metal base plate (5). The cooling system has on one side a layer of aluminum with or without cooling fins (6). The walls of the cooling system pointing inwards the housing have an isolating layer.