| 摘要 |
<p>The invention relates to a substrate chucking method, etc., wherein in a sputtering device, a disk-like substrate having no center hole is stably closely contacted with a holder and thereby held. Specifically, a disk-like substrate having a substantially cylindrical projection in the center of the back surface is used, and in a sputtering device, this projection is inserted in a recess formed in a substrate support and having a cylindrical inner surface, and is fixed therein by a fixing means disposed in the recess, the back surface of the substrate being closely contacted with a flat surface and thereby supported, the flat surface being the substrate support formed around the recess.</p> |
