Composite electrode for plasma etching system, e.g. for semiconductor substrate processing has locking ring for anchoring composite electrode

摘要

The composite electrode includes a compound (3) for fixing an electrode disk (1) to a receiving ring (2). The electrode disk is secured by engagement with a groove in the internal circumference of a locking ring (10) for anchoring the composite electrode. The external circumference of the electrode disk has a corresponding rib (15).