| 摘要 |
<p>A receptacle assembly includes a guide frame having a front end with an opening to an interior cavity of the guide frame. The opening is configured to receive a module assembly. The guide frame has a bottom with a bottom opening to the interior cavity, and the bottom is configured to be joined to a circuit board. An EMI gasket is provided along at least a portion of a perimeter of the bottom opening to be held between the guide frame and a circuit board. The EMI gasket forms a shielded interface along the portion of the perimeter of the bottom opening. Conductive straps are provided along the leading edge of the opening and have widths sufficient to cover a substantial majority of the leading edge to form a shielded interface along the leading edge. An EMI gasket including a skirt extending partially along a portion of the perimeter of the bottom opening is also provided.</p> |
