SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

A semiconductor substrate the functional element of which is prevented from being broken down by cutting during the process of manufacturing a semiconductor device. A semiconductor substrate (1) is characterized in that cutting start regions (9a, 9b) are formed inside a melting process region by multiphoton absorption by irradiation with a laser beam at the focal point of the laser beam. Thus, a functional element is formed on the surface of the semiconductor substrate as conventional. Since the cutting start regions (9a, 9b) are formed inside the semiconductor substrate (1), the semiconductor substrate (1) is cut by high-precision breaking with a relatively small force along the cutting start regions (9a, 9b).