发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
摘要 <p>A photosensitive resin composition which has high sensitivity while retaining properties such as suitability for tinting, resistance to plating, and removability; and a layered product. The photosensitive resin composition comprises (a) a carboxylated thermoplastic polymer, (b) an ethylenic addition-polymerizable monomer having a specific structure, (c) a photopolymerization initiator comprising a 2-(o-chlorophenyl)-4,5-diphenylimidazolyl dimer, and (d) a dye comprising Diamond Green. A layer of the composition is formed on a support layer. Also provided are a method of forming a resist pattern with the layered photosensitive-resin product and a process for producing a printed wiring board, lead frame, or semiconductor package.</p>
申请公布号 WO2003077035(P1) 申请公布日期 2003.09.18
申请号 JP2003002800 申请日期 2003.03.10
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