| 摘要 |
The present invention relates to impedance matching for high frequency electronic circuits. According to the invention, an electronic component (100) is mounted on a component carrier 5 (110). At least one electrical connection (101a, 101b) of the electronic component (100) is thereby connected to a contact area (102a, 102b) on the component carrier (110). A dielectric substance (105) is deposited between the electronic component (100) and the component carrier (110) such that the substance 10 (105) coats a portion (hs) of the at least one electrical connection (101a, 101b). The substance (105) has a dielectric constant (Er,s), which is substantially higher than the dielectric constant of air, for example in the range 3,0 - 10. |
