发明名称 Assembly for embolic treatments
摘要 An assembly for embolization is provided, which includes a simplified member and an embolic material inducing an improved thrombus in vascular malformations. The assembly comprises an implant to be inserted within the target site; and a guiding member with its distal end coupled with the implant, for guiding the implant to the target site, wherein the guiding member is made of an electrically conducting material and includes a multiplicity of tapered configurations.
申请公布号 US2003176857(A1) 申请公布日期 2003.09.18
申请号 US20030386824 申请日期 2003.03.12
申请人 LEE KYU HO 发明人 LEE KYU HO
分类号 A61B17/12;(IPC1-7):A61B18/18 主分类号 A61B17/12
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