发明名称 Anodic bonding structure, fabricating method thereof, and method of manufacturing optical scanner using the same
摘要 Provided are an anodic bonding structure, a fabricating method thereof, and a method of manufacturing an optical scanner using the same. Provided anodic bonding structure having a substrate and a glass substrate arranged above the substrate, includes at least one dielectric and at least one metal layer deposited between the substrate and the glass substrate, with a dielectric arranged uppermost, wherein the uppermost dielectric and the glass substrate are anodic bonded. Provided method of fabricating an anodic bonding structure having a substrate and a glass substrate arranged above the substrate, includes an act of depositing at least one dielectric and at least one metal layer between the substrate and the glass substrate, with dielectric arranged uppermost, and an act of anodic bonding the uppermost dielectric with the glass substrate. In the provided structure of depositing the metal layer and the dielectric between the substrate and the glass substrate, the dielectric and the glass substrate or the dielectric and the metal layer are anodic bonded so that a stable performance is attained to manufacture various micro-electromechanical systems (MEMS) devices.
申请公布号 US2003175530(A1) 申请公布日期 2003.09.18
申请号 US20030373103 申请日期 2003.02.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO YOUNG-CHUL;LEE JIN-HO;LEE CHANG-SOO
分类号 G02B26/10;B81B1/00;B81B3/00;B81C1/00;(IPC1-7):B32B17/06;C03C27/02 主分类号 G02B26/10
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