ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE

摘要

Integrated circuits (202) utilizing standard commercial packaging are arranged on a printed circuit board (104) to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules (200). A first row of integrated circuits (202) is oriented in an opposite orientation to a second row of integrated circuits (202). The integrated circuits (202) in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register (210). The integrated circuits (202) in a second half of the first row and in the corresponding half of the second row are connected to a second register (220). Each register processes a non-contiguous subset of the bits in each data word.