发明名称 GOLD PLATING SOLUTION AND METHOD FOR GOLD PLATING
摘要 <p>A gold plating solution, characterized in that it comprises an iodide ion, a gold iodide complex ion and a nonaqueous solvent. The gold plating solution exhibits performance capabilities comparable to a cyanide based gold plating solution and also is low in toxicity and highly stable.</p>
申请公布号 WO2003076695(P1) 申请公布日期 2003.09.18
申请号 JP2003002857 申请日期 2003.03.11
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