发明名称 Component assembly and method for producing the same
摘要 The invention relates to a component assembly and a method for producing the same. The component assembly comprises at least one component arranged on a support substrate, for example a printed circuit board. An insulator enclosing the component and comprising two isolating superimposed layers is also arranged on the support substrate. A scaling mass covering the component is arranged inside said insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
申请公布号 US2003173655(A1) 申请公布日期 2003.09.18
申请号 US20020276607 申请日期 2002.11.15
申请人 RISSING LUTZ;OBERMAYER FLORIAN 发明人 RISSING LUTZ;OBERMAYER FLORIAN
分类号 H01L23/24;(IPC1-7):H01L23/495 主分类号 H01L23/24
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