发明名称 |
Component assembly and method for producing the same |
摘要 |
The invention relates to a component assembly and a method for producing the same. The component assembly comprises at least one component arranged on a support substrate, for example a printed circuit board. An insulator enclosing the component and comprising two isolating superimposed layers is also arranged on the support substrate. A scaling mass covering the component is arranged inside said insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
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申请公布号 |
US2003173655(A1) |
申请公布日期 |
2003.09.18 |
申请号 |
US20020276607 |
申请日期 |
2002.11.15 |
申请人 |
RISSING LUTZ;OBERMAYER FLORIAN |
发明人 |
RISSING LUTZ;OBERMAYER FLORIAN |
分类号 |
H01L23/24;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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