发明名称 |
LASER PROCESSING METHOD |
摘要 |
<p>A laser processing method capable of cutting with high precision a work (1) having a variety of laminated structures. A laser beam (L) is applied with a converging point (P) targeted at at least the inside of the substrate of the work (1) consisting of the substrate and a laminated portion provided on the surface (3) of the substrate, thereby forming modified area (7) by multi-phonton absorbing at least the inside of he substrate, and then a cutting start point region (8) by the modified area. The work (1) can be cut with high precision by being cut along this cutting start point region (8).</p> |
申请公布号 |
WO03076120(A1) |
申请公布日期 |
2003.09.18 |
申请号 |
WO2003JP02945 |
申请日期 |
2003.03.12 |
申请人 |
HAMAMATSU PHOTONICS K.K.;FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI |
发明人 |
FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI |
分类号 |
B23K26/38;B28D1/22;B28D5/00;C03B33/02;C03B33/033;C03B33/07;H01L21/301;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|