发明名称 LASER PROCESSING METHOD
摘要 <p>A laser processing method capable of cutting with high precision a work (1) having a variety of laminated structures. A laser beam (L) is applied with a converging point (P) targeted at at least the inside of the substrate of the work (1) consisting of the substrate and a laminated portion provided on the surface (3) of the substrate, thereby forming modified area (7) by multi-phonton absorbing at least the inside of he substrate, and then a cutting start point region (8) by the modified area. The work (1) can be cut with high precision by being cut along this cutting start point region (8).</p>
申请公布号 WO03076120(A1) 申请公布日期 2003.09.18
申请号 WO2003JP02945 申请日期 2003.03.12
申请人 HAMAMATSU PHOTONICS K.K.;FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI 发明人 FUKUYO, FUMITSUGU;FUKUMITSU, KENSHI
分类号 B23K26/38;B28D1/22;B28D5/00;C03B33/02;C03B33/033;C03B33/07;H01L21/301;(IPC1-7):B23K26/38 主分类号 B23K26/38
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