Printed circuit board comprising a conductive ink layer forming conductive paths between vias and an enhanced ink layer with a lower conductivity and higher moisture resistance than the conductive ink layer

摘要

A printed circuit board with vias, comprises a conductive ink layer (102) forming a conductive path between the vias and an enhanced ink layer (104) disposed above the conductive ink layer. The enhanced ink layer has a lower conductivity and higher moisture resistance than the conductive ink layer. An Independent claim is also included for a method of manufacturing the printed circuit board.