| 摘要 |
A semiconductor wafer 6 and a substrate 7 are faced each other, and electrode pads (not shown) of individual semiconductor chips 2 and connecting electrode pads of package bases 3 are bonded at once, and then the semiconductor wafer 6 and the substrate 7 are cut at the same time and divided into semiconductor chips 2. After expanding spaces between the divided semiconductor chips 2 (package bases 3) to a predetermined width by an expanding process, a sealing resin is applied so that the large number of semiconductor chips 2 and package bases 3 are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces, thus a semiconductor device sealed with a resin is formed.
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