APPARATUS FOR INTERFACING ELECTRONIC PACKAGES AND TEST EQUIPMENT,申请号WO2003US06734-传众专利搜索

发明名称	APPARATUS FOR INTERFACING ELECTRONIC PACKAGES AND TEST EQUIPMENT
摘要	A test apparatus (10) for testing electrical devices such as ICs is provided. The test apparatus includes a test socket (12) mounted on a DUT board (14) in which a contact plunger assembly (20) is at least partially positioned.
申请公布号	WO03076957(A1)	申请公布日期	2003.09.18
申请号	WO2003US06734	申请日期	2003.03.05
申请人	RIKA ELECTRONICS INTERNATIONAL;WINTER, JOHN, M.;NELSON, LARRE, H.;BERGERON, JOHN, C.;SARCIONE, LOURIE, M.	发明人	WINTER, JOHN, M.;NELSON, LARRE, H.;BERGERON, JOHN, C.;SARCIONE, LOURIE, M.
分类号	G01R31/26;G01R1/04;G01R1/067;G01R1/073;H01R13/24;H01R33/76;(IPC1-7):G01R31/02	主分类号	G01R31/26
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