发明名称 |
Semiconductor package having oxidation-free copper wire |
摘要 |
A semiconductor package having an oxidation free copper wire that connects a semiconductor chip and a pad is provided. The copper wire is coated with an oxidation free layer. The copper wire provides good electrical characteristics and reliability.
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申请公布号 |
US2003173659(A1) |
申请公布日期 |
2003.09.18 |
申请号 |
US20030385895 |
申请日期 |
2003.03.10 |
申请人 |
FAIRCHILD KOREA SEMICONDUCTOR LTD. |
发明人 |
LEE SANG-DO;KWON YONG-SUK;SHIN JONG-JIN |
分类号 |
H01L21/60;H01B5/02;H01L23/28;H01L23/48;H01L23/49;H01L23/52;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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