| 摘要 |
A grid interposer for testing electrical circuits and a method of making a grid interposer. The grid interposer includes upper and lower conductive surfaces sandwiched on either side of an insulating later, connected to each other by a plurality of vias filled with conductive material. The conductive surfaces are flat topped, and incised with a grid of flat topped peaks which are small enough to cut through oxidation of electrical contacts, and ensure good electrical contact with a variety of electrode shapes. |
