| 摘要 |
<p>An apparatus (21) for slicing semiconductor wafers from a single-crystal ingot (30) includes a web of wire (27) for slicing the ingot into wafers and a frame (23) having a head for supporting the ingot during slicing. The apparatus further includes a controller (71) and a temperature sensor (73) disposed in the head (29) and operable to send a signal to the controller indicating head temperature. The controller (71) is operable to control temperature of a fluid directed to the head in response to the signal thereby to control the head temperature. Methods of slicing wafers are also disclosed.</p> |
