| 摘要 |
The present invention discloses a thermal laminate for the dissipation of heat generated in the vicinity of an installed PCMCIA card. The thermal laminate includes a top film layer, a middle gap filler layer and a bottom layer. The top film layer provides a protective, non-resistive, low friction surface with a soft conformal interface for enhancing the workability of the thermal laminate. The middle gap filler layer is disposed underneath the top film layer and provides a conformal thermal pathway for the heat radiation emitted from the installed PCMCIA card. The bottom layer is disposed underneath the middle gap filler layer and provides a grip to the middle gap filler layer and the top film layer. The bottom layer is made from either a thermal adhesive layer or a copper foil layer. The thermal laminate utilizes sliding contacts for proper housing between a PCMCIA card surface and a heat sink surface to provide better thermal management within an assembly. |
